IPCB Naming Convention for Surface Mount Device 3D Models and Footprints. The 3D CAD solid electronic modes/footprint (land pattern) naming. The IPC Land Pattern Viewer is provided on CD-ROM as part of the IPC- Updates to land pattern dimensions, including patterns for new component . IPCB Naming Convention for Standard SMT Land Patterns. Surface Mount Land Patterns. Component, Category. Land Pattern Name.

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IPC-7351 SMD & PTH Reference Calculators

Process problems include thermal damage to surrounding areas and solder balls. Many semiconductor and component manufacturers take their own approach when they create their packages.

Consecutive drying and iring eliminates the organic components and affects a bond between the ceramic dielectric and glass constituent in the termination. Clearance conditions can vary from 0. Resin selection critical to CTE, lightest weight. Although all three land pattern geometry variations are considered compliant for lead free soldering processes, the Density Level C variant will require more processing capability to ensure a proper wetting of the lead free alloy.

IPC SMD & PTH Reference Calculators – PCB Libraries Forum – Page 1

In addition, the number of soldering processes discussed in the following text are by no means complete. A gradual heating of the printed board assembly is necessary to drive off volatiles from the solder paste. Examples include contractual requirements, modifications to purchase documentation and information on the drawing. You cannot post new topics in this forum You cannot reply to topics in this forum You cannot delete your posts in this forum You cannot edit your posts in this forum You cannot create polls in this forum You cannot vote in polls in this forum.

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Within the component families, body width and lead span are constant, while body length changes jpc the lead count changes. The first test type is a bare printed 7351h test performed by the printed board fabricator. During an year lifetime, the predecessor of IPC rarely underwent changes.

Flexible dielectric Light weight, minimal concern to Size, cost, Z-axis expansion. Consider the relationship of the device orientation within the tape cavity to perforation at the tape carrier material edge. Downloaded the Calculator and tried it but I must be doing something wrong or my math is punked: The SOT 89 package dimensions are designed to meet the needs of both the hybrid and printed board surface mount industries.

The clearance between the body of the component and the packaging Figure SOD Construction and interconnect structure is speciied at 0. Since conductor width control is much more dificult to maintain on outer layers of the printed board, it is better to keep the narrower conductor geometries on the inner layers of a multilayer printed board. Free running gates sometimes cause instability during in-circuit testing.

If solder mask should get onto the optical target, some vision ipd systems may be compromised due to insufficient contrast at the target site.

A jpc is provided in using the information presented in Table and Table Selection of the appropriate autoplacement machine is dictated by the type of components to be placed and the assembly production rate. The surface that package family that allows four optional contact pitch variations; 0.

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IPCb Parts must also be capable of withstanding a minimum duration Figure SOT 89 Construction immersion in molten solder at the time and temperature shown in Table High lead count packages and fine pitch parts, 0.

IPC-7351B Naming Convention for Surface Mount Device 3D Models and Footprints

Each cycle shall consist of 10 to 30 seconds or 20 8. In order to maintain a minimum clearance of 0.

It should be recognized that there may be overlaps of product between classes. Courtyard Excess — The area between the rectangle circumscribing the land pattern and the component, and the outer boundary of the courtyard. In plastic leaded chip carriers, the primary packaging distinction concerns the point in which a chip is incorporated into the package.

One of the major reasons for the occurrence of the void conditions is the entrapped gas that exists under the solder paste during the original paste printing and BGA placement. Some members of the SOIC family are processed on the secondary side and wave soldered.

High packing density is required. When parts are processed by wave solder, correct part orientation must be observed. A blind or plated closed micro-via in the land is typically acceptable for solder attachment of surface mount components.